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Transcend Recommends Corner Bond and Underfill to Increase Reliability for its Embedded Products

Embedded systems are marked by a need for small components, unmatched reliability, and the ability to withstand harsh conditions. Transcend Information, Inc., a leading manufacturer of industrial-grade products, offers corner bond and underfill as customization options for its embedded products to increase reliability under high thermal or vibratory stress, high gravitational acceleration, and high fatigue cycle applications. Transcend continues to invest in developing cutting-edge technologies and expanding its embedded-use flash and DRAM products, offering a track record of excellence in the demanding embedded application market.

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SonicGear Airphone DNC 3000 Review – Budget yet Performing!

Introduction Digital active noise cancellation, Bluetooth 5.4, lightweight & foldable, soft earcup cushion, omnidirectional microphone and up to 27 hours playback... Yes, enjoy all these...

News

Kingston Leads Channel SSD Shipments for the 7th Consecutive Year...

Kingston Technology, a world leader in memory products and technology solutions, today announced TrendForce has named it as the number one third-party supplier of...