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Transcend Recommends Corner Bond and Underfill to Increase Reliability for its Embedded Products

Embedded systems are marked by a need for small components, unmatched reliability, and the ability to withstand harsh conditions. Transcend Information, Inc., a leading manufacturer of industrial-grade products, offers corner bond and underfill as customization options for its embedded products to increase reliability under high thermal or vibratory stress, high gravitational acceleration, and high fatigue cycle applications. Transcend continues to invest in developing cutting-edge technologies and expanding its embedded-use flash and DRAM products, offering a track record of excellence in the demanding embedded application market.

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SonicGear TWS Q1 & Q3 ANC Review – Excellent Sound for...

Introduction Budget ANC wireless earbuds are not good? Not at all. In fact, they are getting better and better each day. Yup, SonicGear TWS Q1...

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Kingston Technology Remains Top DRAM Module Supplier for 2023

Kingston Technology, a world leader in memory products and technology solutions, today announced it has been ranked top third-party DRAM module supplier in the...